Doctech specialises in developing copper metallisation technology for three-dimensional chip stacking and advanced packaging applications. Our solutions provide exceptional uniformity, high purity, excellent via filling and cost-effective manufacturing. Based on our patented composite nanotwin copper and nano-crystalline copper technology, we provide forward-looking material breakthroughs for advanced electronic applications. Controlling the formulation of additives to obtain suitable copper grains is the key technology for the construction of redistribution layers, through-silicon vias (TSVs), interconnects, copper pillars and copper-copper bonding. We also have related products and customer services in copper probe cards related to chip packaging testing, copper grid electrodes on silicon solar cells, and PET copper foil for lithium batteries of electric vehicles. Doctech aims to become a supplier of next-generation electroplating chemicals and technologies for the semiconductor manufacturing and packaging industries.
Dr Chung Chih-Chun (Graduate, National Yang Ming Chiao Tung University)
Professor Feng Shien-Ping (Professor, Dept. of Systems Engineering, CityU)
Dr Huang Yu-Ting (Graduate, The University of Hong Kong)
Dr Cherng Sheng-Jye (Graduate, National Chung Hsing University)
Dr Mu Kaiyu (Graduate, The University of Hong Kong)
(Info based on the company's application form)
- CityU HK Tech 300 Angel Fund (2023)