Advanced Matter and Materials

19 - 20 Sep 2022

A two-day Forum on “Advanced Matter and Materials” is planned to focus on microelectronic packaging and mechanical behaviour of materials. In Day-1, the great potential in linking microelectronic devices to biomedical applications will be emphasized and explored, including the utilization of copper cloth with (111) uni-directionally oriented nano-twin copper as a new electronic packaging matter to inactivate Covid-19 virus rapidly. In Day-2, innovative approaches in alloy design to overcome the limitation of materials performances will be the focus. Eminent scholars from academia to industry will share their findings and explore ways on the development of advanced materials.